Parylene D

1. Basic information of Parylene D

Product name: Parylene D;

Alias: Tetrachlorotricyclo[8.2.2.24,7]hexadecane-4,6,10,12,13,15-hexaene, Tetrachloro[2.2]paracyclophane

Purity: ≥98%（HPLC）

CAS number:  30501-29-2

Molecular formula:  C₁₆H₁₂C_l4

Molecular weight:346.078

Appearance: White to off-white powder

Melting point: 130-140 ºC

Storage conditions: Store at room temperature

Usage description: Parylene D can be used for high-purity passivation and dielectric layers in the fields of microelectronics and semiconductors; in the field of MEMS as passivation, protection, lubrication and other coatings; in the fields of biomedical anti-corrosion and cultural relics protection as isolation, curing and reinforcement materials.

2.Introduction of Parylene D

Parylene D is produced from the same raw materials as parylene N dimer. It is modified by replacing two hydrogen atoms on the benzene ring with chlorine atoms to increase the density of the material. The properties of parylene D are similar to parylene C, but it can withstand higher operating temperatures than parylene C and has stronger barrier properties to hydrogen sulfide. Parylene D film has a higher dielectric constant compared to the fluorine atom substituted parylene material, and is especially suitable for organic field effect transistors (doi:10.1021/acs.jpca.5b07459).

3.Coating example ¹

Choose silicon substrate for thin film preparation

(1) Cleaning treatment of silicon substrate

(2) Parylene D deposition: sublimate the dimer of solid parylen D at 1 Torr, 100℃-140℃, and then split the CH2-CH2 bond of the dimer at 0.5 Torr, 600℃-700℃ Stable monomer free radicals. Finally, these gaseous monomers enter the deposition chamber at a pressure of 0.1 Torr, and polymerize at room temperature to form a parylene D film and apply to the substrate.

4.Parylene D film properties

Table 1. Thermal properties of parylene D

Table 2. The mechanical properties and barrier properties of parylene D

Table 3. Electrical properties of parylene D

References:

 [1]Dielectric Investigation of Parylene D Thin Films: Relaxation and Conduction Mechanisms，J. Phys. Chem. A 2015, 119, 35, 9210–9217