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Parylene F

2021-07-27 来源:亚科官网

1. Basic information of Parylene F

Product name: Octafluoro-p-xylene dimer

Alias: Parylene F Dimer, Parylene F

Purity: ≥98%

CAS number: 1785-64-4

Molecular formula: C16H8F8

Molecular weight: 352.2219

Appearance: white flake crystal

Melting point: 321 ºC (BP)

Storage conditions: storage at room temperature

Usage description: Parylene F is used for high-purity passivation and dielectric layers in the fields of microelectronics and semiconductor; in the field of MEMS as passivation, protection, lubrication and other coatings; in the fields of biomedical anti-corrosion and cultural relics protection as isolation, curing, and reinforcement materials.

2.Introduction of Parylene F

Parylene F is the 4 hydrogen atoms on the benzene ring replaced by fluorine atoms. It has good high temperature resistance, UV resistance, lower dielectric constant, good wave transmission performance, and is widely used in high-end outdoor LED screen waterproofing protection, waterproof protection of PCB circuit motherboards of new energy electric vehicles, high-end medical equipment coating, etc.

3.Parylene F coating example 1 (functional materials, 2011, S3(42), 477-480)

Using parylene F dimer as raw material (purity ≥95%), using PDS2010 coating furnace, the highest sublimation temperature is 170℃, the cracking temperature is 690℃, the background vacuum of the deposition chamber is 10 mT, the deposition pressure is 32 mT, and quartz The glass plate is the substrate for film preparation. The film forming process includes the following steps:

(1) Parylene F dimer sublimates into gaseous dimer at 90℃-170℃;

(2) At 600°C-720°C, the gaseous dimer is decomposed into active monomer free radicals;

(3) After monomer free radicals enter the deposition chamber, they are deposited and polymerized on the surface of the substrate to form high molecular polymers

4.Parylene F film properties

Table 1. Thermal properties of parylene F

Melting point

435℃

Glass transition temperature

60-66℃

Continuous use temperature (1000 hours)

350℃

Short-term use temperature

120℃

Thermal conductivity

0.1 W/(m·K)


Table 2. The mechanical properties and barrier properties of parylene F

Mechanical properties

ASTM D882

Tensile modulus

3.0 Gpa

Yield strength

52 Mpa

tensile strength

55 Mpa

Elongation

2.5%

Elongation at break

10%-50%

Barrier performance

ASTM E96

Water vapor penetration(37℃,10μm)

35 g/m2·day

Table 3. Electrical properties of parylene F

Dielectric constant

ASTM D150

60Hz

2.20

1kHz

2.25

1MHz

2.42

Dielectric loss

ASTM D150

60Hz

0.0002

1kHz

0.0013

1MHz

0.0080

Dielectric strength

7000 V/mil@1 mil

Volume resistivity

(23℃,50%RH)

ASTM D257

1.1×1017Ω·cm

Surface resistivity

(23℃,50%RH)

ASTM D257

4.7×1017Ω

References:

Preparation and research of Parylene F film dielectric materials, Functional Materials, 2011, S3(42), 477-480