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Parylene F
1. Basic information of Parylene F
Product name: Octafluoro-p-xylene dimer
Alias: Parylene F Dimer, Parylene F
Purity: ≥98%
CAS number: 1785-64-4
Molecular formula: C16H8F8
Molecular weight: 352.2219
Appearance: white flake crystal
Melting point: 321 ºC (BP)
Storage conditions: storage at room temperature
Usage description: Parylene F is used for high-purity passivation and dielectric layers in the fields of microelectronics and semiconductor; in the field of MEMS as passivation, protection, lubrication and other coatings; in the fields of biomedical anti-corrosion and cultural relics protection as isolation, curing, and reinforcement materials.
2.Introduction of Parylene F
Parylene F is the 4 hydrogen atoms on the benzene ring replaced by fluorine atoms. It has good high temperature resistance, UV resistance, lower dielectric constant, good wave transmission performance, and is widely used in high-end outdoor LED screen waterproofing protection, waterproof protection of PCB circuit motherboards of new energy electric vehicles, high-end medical equipment coating, etc.
3.Parylene F coating example 1 (functional materials, 2011, S3(42), 477-480)
Using parylene F dimer as raw material (purity ≥95%), using PDS2010 coating furnace, the highest sublimation temperature is 170℃, the cracking temperature is 690℃, the background vacuum of the deposition chamber is 10 mT, the deposition pressure is 32 mT, and quartz The glass plate is the substrate for film preparation. The film forming process includes the following steps:
(1) Parylene F dimer sublimates into gaseous dimer at 90℃-170℃;
(2) At 600°C-720°C, the gaseous dimer is decomposed into active monomer free radicals;
(3) After monomer free radicals enter the deposition chamber, they are deposited and polymerized on the surface of the substrate to form high molecular polymers
4.Parylene F film properties
Table 1. Thermal properties of parylene F
Melting point | 435℃ |
Glass transition temperature | 60-66℃ |
Continuous use temperature (1000 hours) | 350℃ |
Short-term use temperature | 120℃ |
Thermal conductivity | 0.1 W/(m·K) |
Table 2. The mechanical properties and barrier properties of parylene F
Mechanical properties ASTM D882 | Tensile modulus | 3.0 Gpa |
Yield strength | 52 Mpa | |
tensile strength | 55 Mpa | |
Elongation | 2.5% | |
Elongation at break | 10%-50% | |
Barrier performance ASTM E96 | Water vapor penetration(37℃,10μm) | 35 g/m2·day |
Table 3. Electrical properties of parylene F
Dielectric constant ASTM D150 | 60Hz | 2.20 |
1kHz | 2.25 | |
1MHz | 2.42 | |
Dielectric loss ASTM D150 | 60Hz | 0.0002 |
1kHz | 0.0013 | |
1MHz | 0.0080 | |
Dielectric strength | 7000 V/mil@1 mil | |
Volume resistivity (23℃,50%RH) ASTM D257 | 1.1×1017Ω·cm | |
Surface resistivity (23℃,50%RH) ASTM D257 | 4.7×1017Ω |
References:
Preparation and research of Parylene F film dielectric materials, Functional Materials, 2011, S3(42), 477-480