Search Product
Structure Search
Search
Advantage Products
Location: Thematic focus
Parylene series of materials Parylene C
1.Basic information of Parylene C
Product name: Dichlorop-xylene dimer
Alias: Parylene; Parylene C, Dichlorodi-p-xylylene, Dichloro-[2,2]-paracyclophane
Purity: ≥99.5%
CAS Number: 28804-46-8
Molecular formula: C16H14Cl2
Molecular weight: 277.193
Appearance: white crystalline powder, white particles
Melting point: 165-167°C (MP)
Storage conditions: Store at room temperature
Usage description: Parylene C is a protective polymer material, which can be vapor deposited under vacuum. The penetrating power of the molecules enables it to form a pinhole-free high-quality protective layer inside, at the bottom, and around the component. It can be used in microelectronics, semiconductors, printed circuit board biosensors, cultural relics protection and other fields.
2.Introduction of Parylene C
Compared with parylene N, only one hydrogen atom on the benzene ring is replaced by a chlorine atom. Parylene C combines effective electrical and physical properties, and has lower permeability to moisture, liquids and corrosive gases. It can provide a pinhole-free coating barrier and can be applied to the coating of key medical electronic components.The advantage of Parylene C is that it is deposited on the substrate faster than parylene N. The disadvantage is that the film has poor thermal aging resistance, UV aging resistance, and radiation aging resistance.
3.Coating examples1
316L grade stainless steel is selected as the substrate, and the coating steps are as follows:
(1) Adopt dipping method (solution: 0.5 vol% methacryloxypropyltrimethoxysilane dissolved in 50% water/50% isopropanol, immersion time: 30 minutes, drying treatment: high pressure argon at 65°C Dry under air for 30 minutes), cover a layer of silane coupling agent A174 on the surface of stainless steel metal;
(2) Coating by CVD method through Para Tech Coating Scandinavia AB equipment. Parylene N dimer, as the precursor, decomposes into reactive monomers at 650℃, and then spontaneously deposits and polymerizes at room temperature.
4.Parylene C film properties
Table 1. Thermal properties of parylen C
Melting point | 290℃ |
T5 Point (Modulus=690 Mpa) | 125℃ |
T4 Point (Modulus=70Mpa) | 240℃ |
Continuous use temperature | 80℃ |
Short-term use temperature | 100℃ |
Coefficient of linear thermal expansion at 25℃ | 35 ppm |
Thermal conductivity at 25°C | 0.084 W/(m·K) |
Specific heat capacity at 20℃ | 0.712 J/(g·K) |
Table 2. Mechanical properties and barrier properties of parylene C
Mechanical properties ASTM D882 | Tensile modulus | 2.4 Gpa |
Yield strength | 42 Mpa | |
tensile strength | 45 Mpa | |
Elongation | 2.5% | |
Elongation at break | 20%-200% | |
Barrier performance ASTM E96 | Water vapor penetration(37℃,10μm) | 10 g/m2·day |
Table 3. Electrical properties of parylene C
Dielectric constant ASTM D150 | 60Hz | 3.15 |
1kHz | 3.10 | |
1MHz | 2.95 | |
Dielectric loss ASTM D150 | 60Hz | 0.020 |
1kHz | 0.019 | |
1MHz | 0.013 | |
Dielectric strength | 5600 V/mil | |
DC breakdown | 10μm | ~3500V |
25μm | ~5600V | |
Volume resistivity (23℃,50%RH) ASTM D257 | 8.8×1016Ω·cm | |
Surface resistivity (23℃,50%RH) ASTM D257 | 1.0×1014Ω |
References:
1.Parylene coatings on stainless steel 316L surface for medical applications—Mechanical and protective properties,Materials Science and Engineering C,2011,doi:10.1016/j.msec.2011.09.007