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Parylene series of materials Parylene C

2021-07-14 来源:亚科官网

1.Basic information of Parylene C

Product name: Dichlorop-xylene dimer

Alias: Parylene; Parylene C, Dichlorodi-p-xylylene, Dichloro-[2,2]-paracyclophane

Purity: ≥99.5%

CAS Number: 28804-46-8

Molecular formula: C16H14Cl2

Molecular weight: 277.193

Appearance: white crystalline powder, white particles

Melting point: 165-167°C (MP)

Storage conditions: Store at room temperature

Usage description: Parylene C is a protective polymer material, which can be vapor deposited under vacuum. The penetrating power of the molecules enables it to form a pinhole-free high-quality protective layer inside, at the bottom, and around the component. It can be used in microelectronics, semiconductors, printed circuit board biosensors, cultural relics protection and other fields.

2.Introduction of Parylene C

     Compared with parylene N, only one hydrogen atom on the benzene ring is replaced by a chlorine atom. Parylene C combines effective electrical and physical properties, and has lower permeability to moisture, liquids and corrosive gases. It can provide a pinhole-free coating barrier and can be applied to the coating of key medical electronic components.The advantage of Parylene C is that it is deposited on the substrate faster than parylene N. The disadvantage is that the film has poor thermal aging resistance, UV aging resistance, and radiation aging resistance.

3.Coating examples1

   316L grade stainless steel is selected as the substrate, and the coating steps are as follows:

 (1) Adopt dipping method (solution: 0.5 vol% methacryloxypropyltrimethoxysilane dissolved in 50% water/50% isopropanol, immersion time: 30 minutes, drying treatment: high pressure argon at 65°C Dry under air for 30 minutes), cover a layer of silane coupling agent A174 on the surface of stainless steel metal;

(2) Coating by CVD method through Para Tech Coating Scandinavia AB equipment. Parylene N dimer, as the precursor, decomposes into reactive monomers at 650℃, and then spontaneously deposits and polymerizes at room temperature.

4.Parylene C film properties

Table 1. Thermal properties of parylen C

Melting point

290℃

T5 Point

(Modulus=690 Mpa)

125℃

T4 Point

(Modulus=70Mpa)

240℃

Continuous use temperature

80℃

Short-term use temperature

100℃

Coefficient of linear thermal expansion at 25℃

35 ppm

Thermal conductivity at 25°C

0.084 W/(m·K)

Specific heat capacity at 20℃

0.712 J/(g·K)

Table 2. Mechanical properties and barrier properties of parylene C

Mechanical properties

ASTM D882

Tensile modulus

2.4 Gpa

Yield strength

42 Mpa

tensile strength

45 Mpa

Elongation

2.5%

Elongation at break

20%-200%

Barrier performance

ASTM E96

Water vapor penetration(37℃,10μm)

10 g/m2·day

 Table 3. Electrical properties of parylene C

Dielectric constant

ASTM D150

60Hz

3.15

1kHz

3.10

1MHz

2.95

Dielectric loss

ASTM D150

60Hz

0.020

1kHz

0.019

1MHz

0.013

Dielectric strength

5600 V/mil

DC breakdown

10μm

~3500V

25μm

~5600V

Volume resistivity (23℃,50%RH)

ASTM D257

8.8×1016Ω·cm

Surface resistivity

(23℃,50%RH)

ASTM D257

1.0×1014Ω


References:

1.Parylene coatings on stainless steel 316L surface for medical applications—Mechanical and protective properties,Materials Science and Engineering C,2011,doi:10.1016/j.msec.2011.09.007