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Parylene HT
1. Basic information of Parylene HT
Product name: Fluorinated dimer para-xylene;
Alias: 1,1,2,2,9,9,10,10-Octafluoro[2.2]paracyclophane,Parylene AF4
Purity: ≥98%
CAS number: 3345-29-7
Molecular formula: C16H8F8
Molecular weight: 352.2219
Appearance: white crystal
Melting point: 240-250 ºC
Storage conditions: sealed
Usage description: Parylene HT is used for high-purity passivation and dielectric layers in the fields of microelectronics and semiconductor; in the field of MEMS as passivation, protection, lubrication and other coatings; in the fields of biomedical anti-corrosion and cultural relic protection as isolation, curing and reinforcement materials.
2.Introduction of Parylene HT
Compared with parylene N, Parylene HT only replaces the hydrogen atoms on the methylene group with F atoms, which significantly improves the anti-oxidation, anti-ultraviolet, and anti-radiation capabilities of the parylene film. Parylene HT film has many excellent functions such as moisture resistance, mildew resistance and salt spray resistance, and is widely used in military radars, electronic devices and cultural relics protection.
3.Coating example
Under the condition of using a vacuum pump to ensure the degree of vacuum, AF4 is gasified in a high-temperature sublimation furnace, and after entering the cracking furnace, it is cracked into monomer free radicals at high temperature, and then enters the deposition chamber for free radical polymerization to form parylene HT film. Coating process parameters: The pressure in the sublimation furnace is controlled at approximately 13.30 Pa, which is close to vacuum, the cracking temperature is controlled at 650°C, the pressure of the deposition chamber is controlled at about 2.66-5.32 Pa, the substrate temperature is 0°C, and the deposition rate is about 1.5× 10-8 cm/min.
4.Parylene HT film properties
Table 1. Thermal properties of parylene HT
Melting point | >500℃ |
T5 Point (Modulus = 690 Mpa) | 377℃ |
T4 Point (Modulus =70 Mpa) | >450℃ |
Continuous use temperature | 350℃ |
Short-term use temperature | 450℃ |
Coefficient of linear thermal expansion at 25℃ | 36 ppm |
Table 2. The mechanical properties and barrier properties of parylene HT
Mechanical properties ASTM D882 | Tensile modulus | 2.5 Gpa |
Yield strength | 48 Mpa | |
tensile strength | 50 Mpa | |
Elongation | 2% | |
Elongation at break | 10% | |
Barrier performance ASTM E96 | Water vapor penetration(37℃,10μm) | 20 g/m2·day |
Table 3. Electrical properties of parylene HT
Dielectric constant ASTM D150 | 60Hz | 2.21 |
1kHz | 2.20 | |
1MHz | 2.17 | |
Dielectric loss ASTM D150 | 60Hz | <0.0002 |
1kHz | 0.0020 | |
1MHz | 0.0010 | |
Dielectric strength | 5400 V/mil | |
Volume resistivity (23℃,50%RH) ASTM D257 | 2.0×1017Ω·cm | |
Surface resistivity (23℃,50%RH) ASTM D257 | 5.0×1015Ω |
References:
Research on the preparation process of parylene HT film raw materials[D], Southeast University, 2016