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Parylene HT

2021-07-27 来源:亚科官网

1. Basic information of Parylene HT

Product name: Fluorinated dimer para-xylene;

Alias: 1,1,2,2,9,9,10,10-Octafluoro[2.2]paracyclophane,Parylene AF4

Purity: ≥98%

CAS number: 3345-29-7

Molecular formula: C16H8F8

Molecular weight: 352.2219

Appearance: white crystal

Melting point: 240-250 ºC

Storage conditions: sealed

Usage description: Parylene HT is used for high-purity passivation and dielectric layers in the fields of microelectronics and semiconductor; in the field of MEMS as passivation, protection, lubrication and other coatings; in the fields of biomedical anti-corrosion and cultural relic protection as isolation, curing and reinforcement materials.

2.Introduction of Parylene HT

Compared with parylene N, Parylene HT only replaces the hydrogen atoms on the methylene group with F atoms, which significantly improves the anti-oxidation, anti-ultraviolet, and anti-radiation capabilities of the parylene film. Parylene HT film has many excellent functions such as moisture resistance, mildew resistance and salt spray resistance, and is widely used in military radars, electronic devices and cultural relics protection.

3.Coating example

Under the condition of using a vacuum pump to ensure the degree of vacuum, AF4 is gasified in a high-temperature sublimation furnace, and after entering the cracking furnace, it is cracked into monomer free radicals at high temperature, and then enters the deposition chamber for free radical polymerization to form parylene HT film. Coating process parameters: The pressure in the sublimation furnace is controlled at approximately 13.30 Pa, which is close to vacuum, the cracking temperature is controlled at 650°C, the pressure of the deposition chamber is controlled at about 2.66-5.32 Pa, the substrate temperature is 0°C, and the deposition rate is about 1.5× 10-8 cm/min.

4.Parylene HT film properties

Table 1. Thermal properties of parylene HT

Melting point

>500℃

T5 Point

(Modulus = 690 Mpa)

377℃

T4 Point

(Modulus =70 Mpa)

>450℃

Continuous use temperature

350℃

Short-term use temperature

450℃

Coefficient of linear thermal expansion at 25℃

36 ppm

Table 2. The mechanical properties and barrier properties of parylene HT

Mechanical properties

ASTM D882

Tensile modulus

2.5 Gpa

Yield strength

48 Mpa

tensile strength

50 Mpa

Elongation

2%

Elongation at break

10%

Barrier performance

ASTM E96

Water vapor penetration(37℃,10μm)

20 g/m2·day

Table 3. Electrical properties of parylene HT

Dielectric constant

ASTM D150

60Hz

2.21

1kHz

2.20

1MHz

2.17

Dielectric loss

ASTM D150

60Hz

<0.0002

1kHz

0.0020

1MHz

0.0010

Dielectric strength

5400 V/mil

Volume resistivity

(23℃,50%RH)

ASTM D257

2.0×1017Ω·cm

Surface resistivity

(23℃,50%RH)

ASTM D257

5.0×1015Ω

References:

Research on the preparation process of parylene HT film raw materials[D], Southeast University, 2016



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