Application of Tricine |CAS:5704-04-1|in the Field of Semiconductor Wafers

Tricine（CAS:5704-04-1） is an excellent amphoteric good's buffer. CN106085245B patent introduces a chemical mechanical polishing (CMP) preparation of copper, and its main components are as follows:

1.Particulate material（0.001-0..25%）: particulate material selected from fumed silica, colloidal silica, fumed alumina, colloidal alumina, ceria, titania, zirconia, polystyrene, polymethylmethacrylate Esters, mica, hydrated aluminium silicates and mixtures thereof.

2.At least two amino acids（0.01-16%）: amino acids independently selected from glycine, serine, lysine, glutamine, L-alanine, DL-alanine, beta-alanine, iminoacetic acid , asparagine, aspartic acid, valine, sarcosine, N-bis(hydroxyethyl) glycine, Tricine, proline and mixtures thereof.

3.Oxidizing agent（0.25-5%）: oxidizing agent is selected from hydrogen peroxide, ammonium dichromate, ammonium perchlorate, ammonium persulfate, benzoyl peroxide, bromate, calcium hypochlorite, ceric sulfate, chloric acid Salt, Chromium Trioxide, Iron Trioxide, Ferric Chloride, Iodate, Iodine, Magnesium Perchlorate, Magnesium Dioxide, Nitrate, Periodic Acid, Permanganic Acid, Potassium Dichromate, Potassium Ferricyanide, Potassium permanganate, potassium persulfate, sodium bismuth, sodium chlorite, sodium dichromate, sodium nitrite, sodium perborate, sulfate, peracetic acid, urea-hydrogen peroxide, perchloric acid, ditertiary Butyl peroxide, monopersulfate, dipersulfate, and combinations thereof.

4.Corrosion inhibitor(0.00001- 2% ): The corrosion inhibitor is selected from nitrogen-containing cyclic compounds, and the nitrogen-containing cyclic compounds are selected from 1,2,3-triazole, 1,2,4-triazole, 5-methylbenzotriazole, benzotriazole, 1-Hydroxybenzotriazole, 4-hydroxybenzotriazole, 4-amino-4H-1,2,4-triazole, benzimidazole, 5-aminotriazole, benzothiazole, triazinethiol, Triazine dithiols and triazine trithiols, isocyanurates and combinations thereof.

References

CN106085245B Low dishing copper chemical mechanical polishing.