CAS：4432-31-9| The Application of MES in electroplating metal

Product Name：MES
CAS：4432-31-9
Molecular Formula：C6H13NO4S
Article No.：M0006
Structural Formula：

Product Introduction
MES is a white solid powder at room temperature and pressure, and its molecular structure contains a morpholine ring and an ethanesulfonic acid group. Morpholine ring is a nitrogen-containing heterocyclic compound with high stability and inertness, and has no obvious toxicity or irritation to living organisms. The ethanesulfonic acid group is a negatively charged functional group with good water solubility and buffering properties. 2-Morpholine ethanesulfonic acid can be used as a component of a buffer and accelerator in cosmetics, biopharmaceuticals, IVD, sealing materials, plant culture and other fields.
Application of MES
In the manufacturing process of the electronics industry, it is generally achieved through electroplating process to fill metal copper into grooves of different sizes, through holes, etc., in order to construct interconnection structures. During the process of electroplating copper to fill the holes and grooves, it is generally necessary to add appropriate additives to the electroplating solution to achieve defect free and uniform filling of the interconnect structure. Common additives include leveling agents, which can help achieve defect free filling of pores and grooves while reducing the difference in copper deposition thickness between interconnected and non interconnected areas, ensuring the surface smoothness of the copper coating and facilitating subsequent chemical mechanical polishing. But as the size of integrated circuit process features continues to decrease, the difficulty of obtaining defect free and high surface smoothness electroplating interconnection layers becomes increasingly high. Therefore, it is necessary to provide a leveling agent suitable for filling holes with smaller feature sizes. In this context, the CN117801262A patent has developed a leveling agent, electroplating composition, and their applications. The electroplating composition includes electroplating additives and metal ion sources.
Electroplating additives include one or more accelerators and inhibitors. The synergistic combination of leveling agents, accelerators, inhibitors, etc. can achieve defect free filling of small-sized holes and grooves, making the surface of the electroplated metal layer tend to be flat. In areas with different wiring densities, the thickness of the surface coating can also be uniform, thereby reducing the technical difficulty of subsequent polishing processes.
Among them, accelerators can be one or more of thiourea, allyl thiourea, acetylthiourea, 2-morpholineethanesulfonic acid, sodium polysulfide (SPS), sodium 2-mercaptoethanesulfonate (MES), sodium 3-mercapto-1-propane sulfonate (MPS), potassium 3-mercapto-1-propane sulfonate, 3-mercapto-propane sulfonate - (3-sulfopropyl) ester, etc.

References
CN117801262A  Leveling agents, electroplating compositions and their applications.